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The Global Memory Packaging market is expected to reach $38.92 billion by 2027 growing at a CAGR of 7.4% during 2020 to 2027. Memory is made from tiny semiconductor chips that are then packaged in a less fragile way to allow them to be integrated into a computer system. The chip packages are more often integrated into larger packages. Computer memory is therefore available in various physical packaging. Factors such as increasing demand for smartphones and the growing popularity of autonomous driving and in-car entertainment (ICE) are driving the market growth. Though, thermal issues due to the miniaturization of memory are restraining the market. Technological developments in multi-level fan-out wafer-level packaging (FOWLP) are opportunities for the memory packaging market. Based on application, NAND flash packaging segment is going to have a huge demand during the forecast period owing to it delivers a cost-effective solution for applications challenging solid-state storage and high density, main manufacturing organizations, in the customer electronics product segment, are adopting this memory device to fulfill the need for storage space. The key vendors mentioned are NEC Corporation, LG Electronics, Apple Inc., Winbond Electronics Corporation, Intel Corporation, Hana Micron Inc., Nanya Technology Corporation, Samsung Electronics Co. Ltd, Dell EMC, SK Hynix Inc., Micron Technology Inc., Western Digital Corporation, Cisco Systems Inc., IBM Corporation, Toshiba Electronic Devices & Storage Corporation, Fujitsu Semiconductor Limited, STMicroelectronics, ASE Group, and Qualcomm Technologies Inc. Platforms Covered: • Lead-Frame • Flip-Chip • Wafer-Level Chip-Scale Packaging (WLCSP) • Wire-Bond Applications Covered: • Dynamic Random Access Memory (DRAM) Packaging • Not AND Flash Packaging • Not OR Flash Packaging • 3D Through-Silicon Via (TSV) Packaging End Users Covered: • Automotive • Consumer Electronics • Information Technology (IT) and Telecom • Embedded Systems • Military and Aerospace • Medical Devices Regions Covered: • North America • Europe • Asia Pacific • South America • Middle East & Africa Key Questions Answered in this Report: • How this market evolved since the year 2019 • Market size estimations, forecasts and CAGR for all the segments presented in the scope • Key Market Developments and financials of the key players • Opportunity Analysis for the new entrants • SWOT Analysis of the key players • Fastest growing markets analyzed during the forecast period
1 Market Synopsis
2 Research Outline
2.1 Research Snapshot
2.2 Research Methodology
2.3 Research Sources
2.3.1 Primary Research Sources
2.3.2 Secondary Research Sources
3 Market Dynamics
3.1 Drivers
3.2 Restraints
4 Market Environment
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Memory Packaging Market, By Platform
5.1 Introduction
5.2 Lead-Frame
5.3 Flip-Chip
5.4 Wafer-Level Chip-Scale Packaging (WLCSP)
5.5 Wire-Bond
6 Global Memory Packaging Market, By Application
6.1 Introduction
6.2 Dynamic Random Access Memory (DRAM) Packaging
6.3 Not AND Flash Packaging
6.4 Not OR Flash Packaging
6.5 3D Through-Silicon Via (TSV) Packaging
7 Global Memory Packaging Market, By End User
7.1 Introduction
7.2 Automotive
7.3 Consumer Electronics
7.4 Information Technology (IT) and Telecom
7.5 Embedded Systems
7.6 Military and Aerospace
7.7 Medical Devices
8 Global Memory Packaging Market, By Geography
8.1 Introduction
8.2 North America
8.3 Europe
8.4 Asia Pacific
8.5 South America
8.6 Middle East & Africa
9 Strategic Benchmarking
10 Vendors Landscape
10.1 NEC Corporation
10.2 LG Electronics
10.3 Apple Inc.
10.4 Winbond Electronics Corporation
10.5 Intel Corporation
10.6 Hana Micron Inc.
10.7 Nanya Technology Corporation
10.8 Samsung Electronics Co. Ltd
10.9 Dell EMC
10.10 SK Hynix Inc.
10.11 Micron Technology Inc.
10.12 Western Digital Corporation
10.13 Cisco Systems Inc.
10.14 IBM Corporation
10.15 Toshiba Electronic Devices & Storage Corporation
10.16 Fujitsu Semiconductor Limited
10.17 STMicroelectronics
10.18 ASE Group
10.19 Qualcomm Technologies Inc.
List of Data Tables
1 Global Memory Packaging Market Outlook, By Region (2019-2027) ($MN)
2 Global Memory Packaging Market Outlook, By Platform (2019-2027) ($MN)
3 Global Memory Packaging Market Outlook, By Lead-Frame (2019-2027) ($MN)
4 Global Memory Packaging Market Outlook, By Flip-Chip (2019-2027) ($MN)
5 Global Memory Packaging Market Outlook, By Wafer-Level Chip-Scale Packaging (WLCSP) (2019-2027) ($MN)
6 Global Memory Packaging Market Outlook, By Wire-Bond (2019-2027) ($MN)
7 Global Memory Packaging Market Outlook, By Application (2019-2027) ($MN)
8 Global Memory Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) Packaging (2019-2027) ($MN)
9 Global Memory Packaging Market Outlook, By Not AND Flash Packaging (2019-2027) ($MN)
10 Global Memory Packaging Market Outlook, By Not OR Flash Packaging (2019-2027) ($MN)
11 Global Memory Packaging Market Outlook, By 3D Through-Silicon Via (TSV) Packaging (2019-2027) ($MN)
12 Global Memory Packaging Market Outlook, By End User (2019-2027) ($MN)
13 Global Memory Packaging Market Outlook, By Automotive (2019-2027) ($MN)
14 Global Memory Packaging Market Outlook, By Consumer Electronics (2019-2027) ($MN)
15 Global Memory Packaging Market Outlook, By Information Technology (IT) and Telecom (2019-2027) ($MN)
16 Global Memory Packaging Market Outlook, By Embedded Systems (2019-2027) ($MN)
17 Global Memory Packaging Market Outlook, By Military and Aerospace (2019-2027) ($MN)
18 Global Memory Packaging Market Outlook, By Medical Devices (2019-2027) ($MN)
19 North America Memory Packaging Market Outlook, By Platform (2019-2027) ($MN)
20 North America Memory Packaging Market Outlook, By Application (2019-2027) ($MN)
21 North America Memory Packaging Market Outlook, By End User (2019-2027) ($MN)
22 Europe Memory Packaging Market Outlook, By Platform (2019-2027) ($MN)
23 Europe Memory Packaging Market Outlook, By Application (2019-2027) ($MN)
24 Europe Memory Packaging Market Outlook, By End User (2019-2027) ($MN)
25 Asia Pacific Memory Packaging Market Outlook, By Platform (2019-2027) ($MN)
26 Asia Pacific Memory Packaging Market Outlook, By Application (2019-2027) ($MN)
27 Asia Pacific Memory Packaging Market Outlook, By End User (2019-2027) ($MN)
28 South America Memory Packaging Market Outlook, By Platform (2019-2027) ($MN)
29 South America Memory Packaging Market Outlook, By Application (2019-2027) ($MN)
30 South America Memory Packaging Market Outlook, By End User (2019-2027) ($MN)
31 Middle East & Africa Memory Packaging Market Outlook, By Platform (2019-2027) ($MN)
32 Middle East & Africa Memory Packaging Market Outlook, By Application (2019-2027) ($MN)
33 Middle East & Africa Memory Packaging Market Outlook, By End User (2019-2027) ($MN)